Smartphones and Beyond: Industry-Wide Mega-Issues and Mega-Opportunities in the Post-Convergence World

Increasing time to market pressures and complex technology challenges in a disaggregated IC and electronics supply chain have brought about major new dynamics into the semiconductor landscape. For example, major integrated device manufacturers (IDMs) have begun to more and more outsource their silicon manufacturing to foundries. Another example is the need for seamless integration of IP with design solutions through kits. These complex challenges are driving semiconductor companies to turn to multi-company collaboration and alliances among geographically dispersed teams responsible for system design, IC design, and semiconductor manufacturing.