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Panel Discussion: Innovation in Smart Phone Technology Needs and Drivers for Future Growth

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Panel Discussion
  • Session
  • Wednesday, 11 May 2011
  • 00:00
  • Duration: 1 hr 3 mins
  • Publication date: 11 May 2011
  • Location: IETTV_Room, IETTV_Venue, Munich, Germany
  • Part of event GSA and IET Semiconductor Forum. Prosperity through Innovation: Capitalising on Emerging Markets, Applications and Growth Opportunities

About the session

The demand for smaller, faster and higher-quality performance devices has made semiconductor companies look at developing next-generation semiconductor chips that will enable new mobile applications that take advantage of high-speed data connections, high-performance applications, added processing capabilities and long battery lifetime. To do this, semiconductor companies must first address the design, power management and architectural challenges while improving quality and performance.This panel focuses on the solutions available (i.e. a process and/or component) which can satisfy the power management, processor speed, quality and performance requirements of new mobile applications and enable semiconductor companies to manage costs and generate profitability.

Channels

Electronics

Electronics

Speakers

  • RE

    Ralf Elias

    Vodafone Group, Head of Branded Products and Terminals Innovation

  • JB

    Jalal Bagherli

    Dialog Semiconductor plc, Chief Executive Officer

  • TB

    Tudor Brown

    ARM Ltd., President

  • JB

    John Bruggeman

    Cadence Design Systems, Inc., Senior Vice President and Chief Marketing Officer

  • MM

    Maria Marced

    TSMC Europe, President

  • JH

    Jack Harding

    eSilicon Corporation, President, Chief Executive Officer and Chairman

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