The demand for smaller, faster and higher-quality performance devices has made semiconductor companies look at developing next-generation semiconductor chips that will enable new mobile applications that take advantage of high-speed data connections, high-performance applications, added processing capabilities and long battery lifetime. To do this, semiconductor companies must first address the design, power management and architectural challenges while improving quality and performance.This panel focuses on the solutions available (i.e. a process and/or component) which can satisfy the power management, processor speed, quality and performance requirements of new mobile applications and enable semiconductor companies to manage costs and generate profitability.