Novel Device Design Methodologies

Tutorial - M.B.1.T Inverse Design of Nanophotonics

Jelena Vuckovic

University of Stanford

Abstract Traditional photonics design results in devices that are very sensitive to the environment and imperfections, bulky, and often inefficient, thereby prohibiting scaling. Photonics inverse design can lead to optimal devices that are much better than state of the art on many figures of merit, fully compatible with foundry based fabrication, and can even enable new functionalities for photonics. Examples include error free transmission in on-chip and chip-to-chip optical interconnects with speed exceeding Tb/s, on chip nonlinear optical isolators, dispersion engineered compact and high-Q resonators, scalable quantum photonics, and even laser driven particle accelerators on chip. Speaker Biography Jelena Vuckovic is the Jensen Huang Professor in Global Leadership in the School of Engineering at Stanford, and a Professor of Applied Physics, by courtesy. Vuckovic has received numerous awards including recently the Geoffrey Frew Fellowship from the Australian Academy of Sciences (2023), the Vannevar Bush Fellowship from the US Department of Defense (2022), the Mildred Dresselhaus Lectureship from MIT (2021), the IET A. F. Harvey Engineering Research Prize (2019), the Distinguished Scholarship from the Max Planck Institute for Quantum Optics (2019). She is a Fellow of the APS, IEEE, and Optica.

M.B.1.1

Modulation Enhancement Through Resonant Microwave-Photonic Co-Design

David Moor1, Yuriy Fedoryshyn1, Jasmin Smajic1, Boris Vukovic1, Wolfgang Heni2, Benedikt Baeuerle2, Marcel Destraz2, Huajun Xu3, Delwin L. Elder3, Lewis E. Johnson3, Ueli Koch1, Juerg Leuthold1

1 ETH Zurich, Institute of Electromagnetic Fields (IEF), 8092 Zurich, Switzerland. 2 Polariton Technologies, 8803 Rüschlikon, Switzerland. 3 University of Washington, Department of Chemistry, Seattle, USA

M.B.1.2

Nested Spiral Chirped Waveguide Bragg Gratings for Tunable Dispersion Compensation

Zhenmin Du1, Tingting Zhang2, Zeyu Liu1, Tianjian Zuo2, Hongwei Chen1

1 Tsinghua University, Beijing, China. 2 Huawei Technologies Co. Ltd., Shenzhen, China