3D ICs - Opportunities and Challenges

The momentum around 3D integration is being embraced by the industry. Approaches based on traditional CMOS downscaling are not seen as the only way to achieve better performance, lower cost or smaller devices. The wireless industry is looking at the 'More than Moore' approach to integrate ICs on top of each other with vertical connections as an alternative path. Leading-edge R&D centers have investigated this technology for a few years and now foundries, fabless, IDMs and packaging houses are referring to it as a strategic axis. First expected benefits of 3D ICs have been identified, some products are already sampling and more are in the plans for the coming years. The impact of 3D integration will no longer be negligible and might reshape some part of the industry. This presentation encompasses thefollowing topics: 3D integration: is it really something new in the wireless industry?; what benefits can be expected from 3D ICs?; 3D through Silicon Via: a true paradigm shift; and what are the challenges and how can they be solved? Both technical and non-technical considerations needs to be handled.