Special Session - PIC Packaging and Integration

The high cost of packaging integrated photonic devices can be a significant hurdle, especially during prototype development and early-stage manufacturing. This is due to a variety of factors, including expensive packaging materials, slow packaging processes that are difficult to automate, and the growing complexity of package designs. Today's photonic packages also require innovative thermal management solutions, as they can contain thousands of optical and electrical interconnects and high levels of device integration within small package footprints. Therefore, the technical challenge faced by designers of photonic-electronic systems is significant. They need to ensure the package design is optimized for performance and incorporates cost-effective packaging materials that can provide long-term reliability. It is also essential that the manufacturing process used is affordable and can scale from prototypes to high volumes.

This workshop brings together leading industry and academic speakers who will present their vision on how to address existing and emerging packaging challenges. Speakers will address topics including packaging materials, equipment and automation, packaging assembly and process flows, design rules and standardization, and collaboration with device foundries for improved management of the total manufacturing ecosystem.

Speakers

Introduction

Peter O’Brien, Tyndall Institute

David Harame, AIM Photonics

Packaging and foundry services at AIM Photonics

David Harame, AIM Photonics

Scaling to high volume packaging at IBM

Alexander Janta-Polczynski, IBM

New packaging process and equipment development

Kevin Shortiss, ficonTEC

Packaging workforce training

Anu Agrawal, MIT