Laser Micro Machining

One of the key processes in micro-electromechanical systems (MEMS) is the deep (i.e. through the depth of the wafer) etching in silicon. This can be achieved by chemical, plasma or laser based processes. This presentation reports on results obtained using a fine jet of water to deliver the laser beam, known as the laser microjet (LMJ) technique. The process is fast, clean, effective and not hostile to the environment. It is direct-write, and highly adaptable to quickly producing structures of variable shapes. Moreover, the LMJ can also etch many other materials, and examples of etching on gallium arsenide, steel, tantalum, alumina and polymers are also shown.