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About the session
Tutorial - We.C.1.T Towards More and More DSP in Higher Speed PON Access Networks
Roberto Gaudino Politecnico di Torino
This Tutorial will present the recent evolutions towards the definition of next-generation physical layer for PON. International standardization bodies (IEEE and ITU-T) are currently considering different options when focusing on 100G-PON or 200G-PON. In both cases, digital signal processing (DSP) will increasingly be needed in the OLT and ONU transceivers. This Tutorial will review the possible options in terms of modulation formats and DSP technologies in relation with the available high-bandwidth optoelectronics. A key point that will be analyzed are the PROs and CONs of IM-DD (which will likely be the choice for 100G-PON) and coherent (for 200G-PON).
Speaker Biography Roberto Gaudino, Ph.D, is Full Professor at Politecnico di Torino, Italy. His current main research interests are in modelling of optical communication systems and in the experimental implementation of optical networks, with specific focus on access networks. In the last years, he focused his activity on next-generation passive optical access networks (PON) and on ultra-high capacity systems for short reach links. Previously, he worked extensively on fiber modelling, optical modulation formats (such as duo-binary, polarization or phase modulation), coherent optical detection, plastic optical fibers and on the experimental demonstration of packet switched optical networks. He is currently the Coordinator of PhotoNext, the Inter-Departmental Center on Applied Photonics at Politecnico di Torino. He is co-author of more than 280 papers in the field of Optical Fiber Transmission and Optical Networks. For further information, please visit www.optcom.polito.it and www.photonext.polito.it.
We.C.1.1
100 GBd Dispersion-Tolerant Downstream PON with 35 dB Power Budget using APD and Low-Complexity Equalization
Vincent Houtsma, Robert Borkowski, Amitkumar Mahadevan, Doutje van Veen
Nokia, Murray Hill, NJ, USA
We.C.1.2
Dispersion Tolerant 200 Gb/s Dual-Wavelength IM/DD Transmission with 33dB Link Budget for Next Generation PON
Ricardo Rosales1, Christian Bluemm1, Kebede Atra1, Youxi Lin1, Rongfang Huang1, Giuseppe Talli1, Xin Chen2, Haibo Wang2, Malcolm Pate2, Pantelis Aivaliotis2
1 Huawei Technologies Duesseldorf GmbH, Munich, Germany. 2 Huawei Technologies Research & Development Ltd., Ipswich, United Kingdom
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