High Speed Devices for Datacomms

Event
  • Session
  • 13:4 - 13:4
  • Duration: 1 hr 40 mins
  • Publication date: 19 Oct 2023
  • Location: M1, SEC, Glasgow, United Kingdom
  • Part of event ECOC 2023

About the session

We.C.6.1

Invited Speaker  - Chip-scale frequency comb generators for datacentres interconnects

Victor Torres-Company

Chalmers University of Technology, Gothenburg, Sweden

We.C.6.2

An Integrated Coherent Driver Modulator Enabled 1.6-Tb/s Coherent Transmission

Di Che1, Xi Chen1, Benjamin Krueger2, Fabio Pittalà2

1 Nokia Bell Labs, Murray Hill, USA. 2 Keysight Technologies Deutschland GmbH, Böblingen, Germany

We.C.6.3

2-ch EML Array and Assembling Technique Operating at 224 Gbps PAM4

Mizuki Shirao1, Shinya Okuda2, Asami Uchiyama2, Takuma Fujita1, Nobuo Ohata1 1 Mitsubishi Electric Corp, Kanagawa, Japan. 2 Mitsubishi Electric Corp, Hyogo, Japan

We.C.6.4

Universal Silicon Depletion Ring Resonator for an Error Free Transmission Link

Junbo Zhu1, Weiwei Zhang2, Ke Li2, Bharat Pant2, Martin Ebert2, Xingzhao Yan2, Mehdi Banakar2, Dehn Tran2, Callum Littlejohns2, Fuwan Gan2, Graham Reed2, David Thomson2 1 Shanghai Institute of Microsystem and Information Technology, Shanghai, China. 2 University of Southampton, Southampton, United Kingdom

We.C.6.5

230-Gb/s on-chip optical interconnection based on GeSi transceiver

Chao Yang1, Dingyi Wu2, Hongguang Zhang2, Ming Luo1, Ying Zhu1, Xiao Hu2, Xi Xiao2

1 CICT, Wuhan, China. 2 NOEIC, Wuhan, China

Keywords:

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