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An experimental evaluation of thermally conductive filler loaded encapsulant composites

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Conference
  • Session
  • Thursday, 10 April 2014
  • 00:10 - 00:10
  • Duration: 12 mins
  • Publication date: 10 Apr 2014
  • Location: IETTV_Room, IETTV_Venue, Manchester, United Kingdom
  • Part of event 7th International Conference on Power, Electronics, Machines & Drives (PEMD 2014)

About the session

In this presentation, epoxy/aluminium oxide powder composites designed for use as encapsulants are produced and thermally characterised. Experimental results obtained for a variety of filler concentrations, sample thicknesses and manufacturing methods are presented and compared to analytical and empirical models from the literature. Further to this, the effects of modifying analytical models using experimental data are considered. This yields models which allow the bulk thermal conductivity of these composites to be predicted more accurately than when the models were used in a purely analytical manner. Furthermore, the effect on the thermal conductivity of uneven filler distribution within the samples is considered.


Channels

Power

Power

Sectors

Sectors

Speaker

  • DH

    David A. Hewitt

    University of Sheffield, Department of Electronic and Electrical Engineering, Electrical Machines and Drives Group, PhD student

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