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3D Integration
Flynn Carson
Presentation from IET and GSA International Semiconductor Track 2
15-May-2008 Electronics channel
>> Play webcast >> recommend to a friendAbout the presentation
The 5th annual IET and GSA International Semiconductor
About the speaker
Vice President Emerging Technology, STATSChipPac Flynn Carson is VP of Emerging Technology at STATS ChipPAC, Inc responsible for new product and technology introduction, especially in the area of advanced 3D packaging. He has over 19 years experience in the semiconductor packaging industry supporting production and developing new products. Flynn received a B.S. in Mechanical Engineering and Material Science from University of California, Davis.
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