From: GSA and IET Semiconductor Forum, Prosperity through Innovation: Capitalising on Emerging Markets, Applications and Growth Opportunities, Munich, 11-12 May 2011 featuring applications in Wireless, Automotive, Smart Utilities and Power Management.
11 May 2011 Electronics channel
The demand for smaller, faster and higher quality performance devices has made semiconductor companies look at developing next-generation semiconductor chips that will enable new mobile applications that take advantage of high-speed data connections, high-performance applications, added processing capabilities and long battery lifetime. (Source: Daniel Nenni). To do this, semiconductor companies must first address the design, power management and architectural challenges while improving quality and performance.
This panel focuses on the solutions available (i.e., a process and/or component) which can satisfy the power management, processor speed, quality and performance requirements of new mobile applications and enable semiconductor companies to manage costs and generate profitability?
Moderator: Ralf Elias, Head of Branded Products and Terminals Innovation, Vodafone Group
* Dr. Jalal Bagherli, Chief Executive Officer, Dialog Semiconducutor
* Tudor Brown, President, ARM
* John Bruggeman, Senior Vice President and Chief Marketing Officer, Cadence Design Systems
* Maria Marced, President, TSMC Europe
* Jack Harding, President, Chief Executive Officer and chairman, eSilicon Corporation