Panel Discussion: Innovation in Smart Phone Technology Needs and Drivers for Future Growth

The demand for smaller, faster and higher quality performance devices has made semiconductor companies look at developing next-generation semiconductor chips that will enable new mobile applications that take advantage of high-speed data connections, high-performance applications, added processing capabilities and long battery lifetime. (Source: Daniel Nenni). To do this, semiconductor companies must first address the design, power management and architectural challenges while improving quality and performance.

This panel focuses on the solutions available (i.e., a process and/or component) which can satisfy the power management, processor speed, quality and performance requirements of new mobile applications and enable semiconductor companies to manage costs and generate profitability?

Moderator: Ralf Elias, Head of Branded Products and Terminals Innovation, Vodafone Group

Panelists:
* Dr. Jalal Bagherli, Chief Executive Officer, Dialog Semiconducutor
* Tudor Brown, President, ARM
* John Bruggeman, Senior Vice President and Chief Marketing Officer, Cadence Design Systems
* Maria Marced, President, TSMC Europe
* Jack Harding, President, Chief Executive Officer and chairman, eSilicon Corporation